| PCB Manufacturing Capability |
| PCB Layers: | 1Layers to 18 layer (Max) |
| Board thickness: | 0.13~6.0mm |
| Min line width/space: | 3mil |
| Min mechanical hole size: | 4mil |
| Copper thickness: | 9um~210um(0.25oz~6oz) |
| Max aspect ratio: | 1:10 |
| Max board size: | 400*700mm |
| Surface Finish: | HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask |
| Material: | FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE. |
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| PCB Assembly Capability |
| Stencil size range: | 1560*450mm |
| Min SMT package: | 0402/1005(1.0x0.5mm) |
| Min IC pitch: | 0.3mm |
| Max PCB Size: | 1200*400mm |
| Min PCB thickness: | 0.35mm |
| Min Chip Size: | 01005 |
| Max BGA Size: | 74*74mm |
| BGA Ball Pitch: | 1.00~3.00mm |
| BGA Ball Diameter: | 0.4~1.0mm |
| QFP Lead Pitch: | 0.38~2.54mm |
| Testing : | ICT,AOI,X-RAY,Funtional test etc. |
Our Advantages:
1, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test, OEM/ODM Serivce
2, Factory Area:60000㎡ Shenzhen factory; two other factories in US and Vietnam
3, Certifcation:ATF 16949,ISO 13485,ISO 14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,
| 1 | Material | PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers |
| 2 | Board Thickness | Mass Production:0.3-3.5mm Samples:0.21-6.0mm |
| 3 | Surface Finish | HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating |
| 4 | PCB Panel Size | Max Mass Productoin: 610x460mm Sample:762x508mm |
| 5 | Layer | Mass production:2-58 Layers, Samples:1-64 Layers |
| 6 | Min. Drill Hole Size | Laser Drill 0.1mm,Machine Drill 0.2mm |
| 7 | PCBA QC | X-ray,AOI Test,Functional Test |
| 8 | Speciality | Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc |
| 9 | Sanforized | Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control |
