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Immersion Silver SMT PCB Assembly FR4 Tg170 Printed Circuit Board Fabrication

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IBE ELectronics Co.,LTD

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Immersion Silver SMT PCB Assembly FR4 Tg170 Printed Circuit Board Fabrication

Delivery Time : 15 WORKING DAYS

MOQ : 1000pcs

Payment Terms : L/C, T/T

Brand Name : IBE

Packaging Details : BAG

Place of Origin : CHINA,VIETNAM,USA

Price : Negotiable

Color : Green,Blue,Black,White,Yellow,Red,Grey

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Surface Mount PCB Assembly

Surface-mount technology (SMT) permits the creation of smaller PCB designs by allowing components to be placed closer together on the board. This means devices can be designed to be more lightweight and compact.

Our Advantages

1, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test, OEM/ODM Serivce

2, Factory Area:60000㎡ Shenzhen factory; two other factories in US and Vietnam

3, Certifcation:ATF 16949,ISO 13485,ISO 14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,

4, Quality Control:IPC-1-610E Standard,E-test,X-ray,AOI Test,IQC,QC,QA,100% Functional Test

1	Material	PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers
2	Board Thickness	Mass Production:0.3-3.5mm Samples:0.21-6.0mm
3	Surface Finish	HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating
4	PCB Panel Size	Max Mass Productoin: 610x460mm Sample:762x508mm
5	Layer	Mass production:2-58 Layers, Samples:1-64 Layers
6	Min. Drill Hole Size	Laser Drill 0.1mm,Machine Drill 0.2mm
7	PCBA QC	X-ray,AOI Test,Functional Test
8	Speciality	Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc
9	Sanforized	Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control

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Immersion Silver SMT PCB Assembly FR4 Tg170 Printed Circuit Board Fabrication

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Immersion Silver SMT PCB Assembly

FR4 Tg170 Printed Circuit Board Fabrication

FR4 Tg170 SMT PCB Assembly

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